IPP048N06L G

IPP048N06L G OptiMOS® Power-Transistor IPB048N06L G Product Summary Features V DS • For fast switching converters and sync. rectification R DS(on),max • N-channel enhancement - logic level SMDversion ID 60 V 4.4 m: 100 A • 175 °C operating temperature • Avalanche rated • Pb-free lead plating, RoHS compliant Type IPP048N06L IPB048N06L Package PG-TO220-3 PG-TO263-3 Marking 048N06L 048N06L Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Continuous drain current ID Value T C=25 °C1) 100 T C=100 °C 100 Pulsed drain current I D,pulse T C=25 °C2) 400 Avalanche energy, single pulse E AS I D=100 A, R GS=25 : 810 Reverse diode dv /dt dv /dt I D=100 A, V DS=48 V, di /dt =200 A/μs, T j,max=175 °C 6 Gate source voltage V GS Power dissipation P tot Operating and storage temperature T j, T stg T C=25 °C IEC climatic category; DIN IEC 68-1 A mJ kV/μs ±20 V 300 W -55 ... 175 °C 55/175/56 1) Current is limited by bondwire; with an RthJC=0.5 the chip is able to carry 161A 2) See figure 3 Rev. 1.13 Unit page 1 2007-08-29 IPP048N06L G Parameter IPB048N06L G Values Symbol Conditions Unit min. typ. max. - - 0.5 minimal footprint - - 62 6 cm2 cooling area3) - - 40 Thermal characteristics Thermal resistance, junction - case R thJC SMD version, device on PCB R thJA K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=1 mA 60 - - Gate threshold voltage V GS(th) V DS=V GS, I D=270 μA 1.2 1.6 2 Zero gate voltage drain current I DSS V DS=60 V, V GS=0 V, T j=25 °C - 0.01 1 V DS=60 V, V GS=0 V, T j=125 °C - 1 100 V μA Gate-source leakage current I GSS V GS=20 V, V DS=0 V - 10 100 nA Drain-source on-state resistance R DS(on) V GS=10 V, I D=100 A - 3.7 4.7 m: V GS=4.5 V, I D=66 A - 4.4 5.7 V GS=10 V, I D=100 A, SMD version 3.4 4.4 V GS=4.5 V, I D=66A, SMD version 4.1 5.4 - 1.9 - : 92 183 - S Gate resistance RG Transconductance g fs |V DS|>2|I D|R DS(on)max, I D=100 A 3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 μm thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.13 page 2 2007-08-29 IPP048N06L G Parameter IPB048N06L G Values Symbol Conditions Unit min. typ. max. - 5700 7600 - 1500 2000 Dynamic characteristics Input capacitance C iss V GS=0 V, V DS=30 V, f =1 MHz pF Output capacitance C oss Reverse transfer capacitance C rss - 350 525 Turn-on delay time t d(on) - 18 27 Rise time tr - 25 38 Turn-off delay time t d(off) - 98 150 Fall time tf - 24 36 Gate to source charge Q gs - 20 26 Gate charge at threshold Q g(th) - 9.1 12 Gate to drain charge Q gd - 54 81 Switching charge Q sw - 64 95 Gate charge total Qg - 169 225 Gate plateau voltage V plateau - 3.5 - Output charge Q oss - 47 63 - - 100 - - 400 - 0.93 1.3 V - 65 80 ns - 125 160 nC V DD=30 V, V GS=4.5 V, I D=100 A, R G=1.3 : ns Gate Charge Characteristics 4) V DD=30 V, I D=100 A, V GS=0 to 10 V V DD=30 V, V GS=0 V nC V Reverse Diode Diode continous forward current IS A T C=25 °C Diode pulse current I S,pulse Diode forward voltage V SD Reverse recovery time t rr Reverse recovery charge Q rr 4) V GS=0 V, I F=100 A, T j=25 °C V R=30 V, I F=I S, di F/dt =100 A/μs See figure 16 for gate charge parameter definition Rev. 1.13 page 3 2007-08-29 IPP048N06L G 1 Power dissipation 2 Drain current P tot=f(T C); V GS•6 V I D=f(T C); V GS•10 V 350 IPB048N06L G 120 300 100 250 200 I D [A] P tot [W] 80 60 150 40 100 20 50 0 0 0 50 100 150 200 0 50 100 T C [°C] 150 200 T C [°C] 3 Safe operating area 4 Max. transient thermal impedance I D=f(V DS); T C=25 °C; D =0 Z thJC=f(t p) parameter: t p parameter: D =t p/T 100 1 μs limited by on-state resistance 10 μs 0.5 100 μs 102 1 ms 10-1 Z thJC [K/W] I D [A] DC 10 ms 10 1 0.2 0.1 0.05 10-2 100 0.02 0.01 single pulse 10-1 10 10-3 -1 10 0 10 1 10 2 V DS [V] Rev. 1.13 10-6 10-5 10-4 10-3 10-2 10-1 100 t p [s] page 4 2007-08-29 IPP048N06L G IPB048N06L G 5 Typ. output characteristics 6 Typ. drain-source on resistance I D=f(V DS); T j=25 °C R DS(on)=f(I D); T j=25 °C parameter: V GS parameter: V GS 10 240 5V 5.5 V 3.5 V 4.5 V 10V 200 8 4V 4V R DS(on) [m:] I D [A] 160 120 3.5 V 6 4.5 V 5V 5.5 V 4 6V 10 V 80 2 40 3V 0 0 0 1 2 0 3 40 80 V DS [V] 120 160 200 160 200 I D [A] 7 Typ. transfer characteristics 8 Typ. forward transconductance I D=f(V GS); |V DS|>2|I D|R DS(on)max g fs=f(I D); T j=25 °C parameter: T j 200 240 180 200 160 140 160 g fs [S] I D [A] 120 100 120 80 80 60 40 175 °C 25 °C 40 20 0 0 0 1 2 3 4 Rev. 1.13 0 40 80 120 I D [A] V GS [V] page 5 2007-08-29 IPP048N06L G 9 Drain-source on-state resistance 10 Typ. gate threshold voltage R DS(on)=f(T j); I D=100 A; V GS=10 V V GS(th)=f(T j); V GS=V DS IPB048N06L G parameter: I D 12 2.5 10 2 2700 μA V GS(th) [V] R DS(on) [m:] 8 98 % 6 1.5 270 μA 1 typ 4 0.5 2 0 0 -60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180 T j [°C] T j [°C] 11 Typ. capacitances 12 Forward characteristics of reverse diode C =f(V DS); V GS=0 V; f =1 MHz I F=f(V SD) parameter: T j 105 25 °C 98% 175 °C 98% 25 °C 102 175 °C 104 I F [A] C [pF] Ciss 101 Coss 103 100 Crss 102 10-1 0 10 20 30 40 50 V DS [V] Rev. 1.13 0 0.5 1 1.5 2 2.5 V SD [V] page 6 2007-08-29 IPP048N06L G 13 Avalanche characteristics 14 Typ. gate charge I AS=f(t AV); R GS=25 : V GS=f(Q gate); I D=100 A pulsed parameter: T j(start) parameter: V DD 103 IPB048N06L G 12 30 V 10 12V 102 8 25 °C V GS [V] 100 °C I AV [A] 48 V 150 °C 101 6 4 2 100 0 100 101 102 103 0 40 80 120 160 200 Q gate [nC] t AV [μs] 15 Drain-source breakdown voltage 16 Gate charge waveforms V BR(DSS)=f(T j); I D=1 mA 75 V GS Qg V BR(DSS) [V] 70 65 V g s(th) 60 55 Q g(th) Q sw Q gs 50 -60 -20 20 60 100 140 Q g ate Q gd 180 T j [°C] Rev. 1.13 page 7 2007-08-29 IPP048N06L G IPB048N06L G PG-TO-263-3 (D²-Pak) Rev. 1.13 page 8 2007-08-29 IPP048N06L G IPB048N06L G PG-TO220-3: Outline Rev. 1.13 page 9 2007-08-29 IPP048N06L G IPB048N06L G Published by Infineon Technologies AG 81726 Munich, Germany © Infineon Technologies AG 2007. All Rights Reserved. Legal disclaimer The information given in this data sheet shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.13 page 10 2007-08-29